OPTIMIZATION OF THE MOUNTING FIELD ELEMENTS OF PRINTED CIRCUIT BOARD AND THE NUMBER OF TRANSFERRING LAYERS

Authors

D.H. HUSIKYAN National Polytechnic University of Armenia Author
A.H. MANUKYAN National Polytechnic University of Armenia Author

Keywords:

integrated circuit, platform, mounting field, number of wire layers

Abstract

The fair compromise method is proposed by which the numbers of the wire layers and MPC are determined. The best ratio of the number of wire layers and elements of the mounting field of the MPC platform by the minimum area of the mounting field and the maximum fill factor is determined.

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Published

15.02.2026

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