THERMAL PLACEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUIT ELEMENTS

A.G. HARUTYUNYAN; A.R. MARTIROSYAN; H.J. HARUTYUNYAN; T.A. GASPARYAN

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A.G. HARUTYUNYAN National Polytechnic University of Armenia Author
A.R. MARTIROSYAN National Polytechnic University of Armenia Author
H.J. HARUTYUNYAN National Polytechnic University of Armenia Author
T.A. GASPARYAN National Polytechnic University of Armenia Author

Keywords:

three-dimensional integrated circuit, circuit partitioning, preliminary distribution of elements thermal placement

Abstract

A method of placement of three-dimensional integrated circuit (IC) elements, ensuring the adjustment of the thermal field is proposed and implemented. The method is based on partitioning the individual levels of circuits by electrical connections and on thermal placement of elements at each level.

THERMAL PLACEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUIT ELEMENTS

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